Method for providing connection between layers of a circuit board
A Standard patent application filed on 27 October 2000 credited to Ligander, Per ; Bergstedt, Leif

Details

Application number :
13212  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for providing connection between layers of a circuit board  
Inventor :
Ligander, Per ; Bergstedt, Leif  
Agent name :
 
Address for service :
 
Filing date :
27 October 2000  
Associated companies :
 
Applicant name :
Telefonaktiebolaget LM Ericsson (PUBL)  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor