A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
A Standard patent application filed on 03 March 2000 credited to Ligander, Per
;
Bergstedt, Leif
Details
Application number :
36883
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method