Integrally bumped electronic package components
A Standard patent application filed on 03 July 1995 credited to Mahulikar, Deepak ; Braden, Jeffrey S ; Hoffman, Paul R.

Details

Application number :
30009  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Integrally bumped electronic package components  
Inventor :
Mahulikar, Deepak ; Braden, Jeffrey S ; Hoffman, Paul R.  
Agent name :
 
Address for service :
 
Filing date :
03 July 1995  
Associated companies :
 
Applicant name :
Olin Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor