Metal electronic package with reduced seal width
A Standard patent application filed on 22 September 1993 credited to Tyler, Derek E.
;
Mahulikar, Deepak
;
Hoffman, Paul R.
;
Braden, Jeffrey S
;
Pasqualoni, Anthony M
Details
Application number :
51326
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Metal electronic package with reduced seal width
Inventor :
Tyler, Derek E.
;
Mahulikar, Deepak
;
Hoffman, Paul R.
;
Braden, Jeffrey S
;
Pasqualoni, Anthony M