Semiconductor chip assemblies, methods of making same and components for same
A Standard patent application filed on 24 September 1991 credited to Distefano, Thomas H
;
Khandros, Igor Y.
Details
Application number :
87312
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Semiconductor chip assemblies, methods of making same and components for same
Inventor :
Distefano, Thomas H
;
Khandros, Igor Y.
Agent name :
Address for service :
Filing date :
24 September 1991
Associated companies :
Applicant name :
Tessera, Inc.
Applicant address :
103 Fairview Park Drive Elsmford NY 10523 United States Of America