Semiconductor inner lead bonding tool
A Standard patent application filed on 21 July 1994 credited to Distefano, Thomas H ; Khandros, Igor Y. ; Grube, Gary W ; Sweis, Jason ; Grange, John ; Mathieu, Gaetan

Details

Application number :

73691  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor inner lead bonding tool  

Inventor :

Distefano, Thomas H ; Khandros, Igor Y. ; Grube, Gary W ; Sweis, Jason ; Grange, John ; Mathieu, Gaetan  

Agent name :

 

Address for service :

 

Filing date :

21 July 1994  

Associated companies :

 

Applicant name :

Tessera, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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