Multi-layer lead frames for integrated circuit packages
A Standard patent application filed on 09 October 1990 credited to Braden, Jeffrey S

Details

Application number :

67274  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Multi-layer lead frames for integrated circuit packages  

Inventor :

Braden, Jeffrey S  

Agent name :

 

Address for service :

 

Filing date :

09 October 1990  

Associated companies :

 

Applicant name :

Olin Corporation  

Applicant address :

 

Old name :

 

Original Source :

Go  

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