Metal electronic package incorporating a multi-chip module
A Standard patent application filed on 02 August 1993 credited to Braden, Jeffrey S ; Mahulikar, Deepak ; Crane, Jacob

Details

Application number :

47938  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Metal electronic package incorporating a multi-chip module  

Inventor :

Braden, Jeffrey S ; Mahulikar, Deepak ; Crane, Jacob  

Agent name :

 

Address for service :

 

Filing date :

02 August 1993  

Associated companies :

 

Applicant name :

Olin Corporation  

Applicant address :

 

Old name :

 

Original Source :

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