Details

Application number :
59198  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Manufacture of printed circuit board assemblies  
Inventor :
Hedges, Philip Stanley ; Rubin, Wallace  
Agent name :
Shelston IP  
Address for service :
Level 21 60 Margaret Street SYDNEY NSW 2000  
Filing date :
20 July 1990  
Associated companies :
 
Applicant name :
Multicore Solders Limited  
Applicant address :
Kelsey House, Wood Lane End, Hemel Hempstead, Hertfordshire HP2 4RQ, United Kingdom  
Old name :
 
Original Source :
Go  

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