An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same
A Standard patent application filed on 16 July 2003 credited to Hwang, Juntae ; Seo, Dongweon

Details

Application number :

2003303968  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same  

Inventor :

Hwang, Juntae ; Seo, Dongweon  

Agent name :

 

Address for service :

 

Filing date :

16 July 2003  

Associated companies :

 

Applicant name :

PHICOM CORPORATION  

Applicant address :

60-29, Gasan-dong, Kumchon-gu, 153-801 Seoul  

Old name :

 

Original Source :

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