Improved package assembly for microwave heating of foods
A Standard patent application filed on 22 June 1988 credited to Arnott, Len A.
;
Bonney, Randall J.
;
Bernau, Lew H.
Details
Application number :
18214
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Improved package assembly for microwave heating of foods
Inventor :
Arnott, Len A.
;
Bonney, Randall J.
;
Bernau, Lew H.
Agent name :
PHILLIPS ORMONDE FITZPATRICK
Address for service :
367 Collins Street MELBOURNE VIC 3000
Filing date :
22 June 1988
Associated companies :
Applicant name :
Pak Pacific Corporation Pty Ltd
Applicant address :
186-206 Dougharty Road Heidelberg West Victoria 3081 Australia