Improved package assembly for microwave heating of foods
A Standard patent application filed on 26 May 1988 credited to Arnott, Len A. ; Bonney, Randall J. ; Bernau, Lew H.

Details

Application number :
16696  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Improved package assembly for microwave heating of foods  
Inventor :
Arnott, Len A. ; Bonney, Randall J. ; Bernau, Lew H.  
Agent name :
PHILLIPS ORMONDE FITZPATRICK  
Address for service :
367 Collins Street MELBOURNE VIC 3000  
Filing date :
26 May 1988  
Associated companies :
 
Applicant name :
Pak Pacific Corporation Pty Ltd  
Applicant address :
 
Old name :
 
Original Source :
Go  

Related Patents

Same Inventor