Method for engraving a thin dielectric layer on a silicon substrate and equipment for carrying out said method
A Standard patent application filed on 06 June 2000 credited to Borsoni, Gilles
;
Lazzari, Jean-Pierre
;
Korwin-Pawlowski, Michael
;
Froment, Michel
Details
Application number :
54119
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method for engraving a thin dielectric layer on a silicon substrate and equipment for carrying out said method
Inventor :
Borsoni, Gilles
;
Lazzari, Jean-Pierre
;
Korwin-Pawlowski, Michael
;
Froment, Michel