Copper source reagent compositions, and method of making and using same for microelectronic device structures
A Standard patent application filed on 22 May 2000 credited to Baum, Thomas H. ; Xu, Chong-ying

Details

Application number :

50388  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Copper source reagent compositions, and method of making and using same for microelectronic device structures  

Inventor :

Baum, Thomas H. ; Xu, Chong-ying  

Agent name :

 

Address for service :

 

Filing date :

22 May 2000  

Associated companies :

 

Applicant name :

Advanced Technology Materials, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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