Details

Application number :
2004287791  
Application type :
Standard  
Application status :
SEALED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Interconnect circuit  
Inventor :
Headrick, Charles R. ; Eaton, William S. ; Kawamura, Naoto ; Ness, Erik D.  
Agent name :
Shelston IP  
Address for service :
Level 21 60 Margaret Street Sydney NSW 2000 Australia  
Filing date :
20 October 2004  
Associated companies :
 
Applicant name :
Hewlett-Packard Development Company, L.P.  
Applicant address :
Hewlett-Packard Company, Intellectual Property Administration 20555 S.H. 249 Houston TX 77070 United States of America  
Old name :
 
Original Source :
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