Interconnect circuit
A Standard patent application filed on 20 October 2004 credited to Headrick, Charles R.
;
Eaton, William S.
;
Kawamura, Naoto
;
Ness, Erik D.
Details
Application number :
2004287791
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Interconnect circuit
Inventor :
Headrick, Charles R.
;
Eaton, William S.
;
Kawamura, Naoto
;
Ness, Erik D.
Agent name :
Shelston IP
Address for service :
Level 21 60 Margaret Street Sydney NSW 2000 Australia
Filing date :
20 October 2004
Associated companies :
Applicant name :
Hewlett-Packard Development Company, L.P.
Applicant address :
Hewlett-Packard Company, Intellectual Property Administration 20555 S.H. 249 Houston TX 77070 United States of America