Circuit pack interconnection
A Standard patent application filed on 28 July 1993 credited to Pongracz, David John ; Chandraiah, Vidyananda Bangalore

Details

Application number :

44263  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Circuit pack interconnection  

Inventor :

Pongracz, David John ; Chandraiah, Vidyananda Bangalore  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

28 July 1993  

Associated companies :

 

Applicant name :

American Telephone and Telegraph Company  

Applicant address :

32 Avenue Of The Americas New York New York 10013 United States Of America  

Old name :

 

Original Source :

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