Liquid adhesion promoter for cord-reinforced rubber and metal or polymer substrate/rubber composites
A Standard patent application filed on 12 November 2003 credited to Wentworth, Gary
;
English, John
;
Chen, Zhi
;
O'Rourke, Stephen
;
Semlow, Stephen
;
Stefanisin, Kimberly L.
Details
Application number :
2003295455
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Liquid adhesion promoter for cord-reinforced rubber and metal or polymer substrate/rubber composites
Inventor :
Wentworth, Gary
;
English, John
;
Chen, Zhi
;
O'Rourke, Stephen
;
Semlow, Stephen
;
Stefanisin, Kimberly L.
Agent name :
Address for service :
Filing date :
12 November 2003
Associated companies :
Applicant name :
CPH INNOVATIONS CORP.
Applicant address :
311 South Wacker Drive, Suite 4700, Chicago, IL 60606-6622