Adhesion promoters for cord-reinforced thermoplastic polymeric materials and substrate/thermoplastic polymeric material composites
A Standard patent application filed on 12 November 2003 credited to Wentworth, Gary ; English, John ; Chen, Zhi ; O'Rourke, Stephen ; Semlow, Stephen ; Stefanisin, Kimberly L.

Details

Application number :
2003287616  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Adhesion promoters for cord-reinforced thermoplastic polymeric materials and substrate/thermoplastic polymeric material composites  
Inventor :
Wentworth, Gary ; English, John ; Chen, Zhi ; O'Rourke, Stephen ; Semlow, Stephen ; Stefanisin, Kimberly L.  
Agent name :
 
Address for service :
 
Filing date :
12 November 2003  
Associated companies :
 
Applicant name :
CPH INNOVATIONS CORPORATION  
Applicant address :
Suite 4700, 311 South Wacker Drive, Chicago, IL 60606-6622  
Old name :
 
Original Source :
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Same Inventor