Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby
A Standard patent application filed on 06 November 2003 credited to Dubin, Valery
Details
Application number :
2003287704
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby
Inventor :
Dubin, Valery
Agent name :
Address for service :
Filing date :
06 November 2003
Associated companies :
Applicant name :
INTEL CORPORATION
Applicant address :
2200 Mission College Boulevard, Santa Clara, CA 95052