Forming a copper diffusion barrier
A Standard patent application filed on 23 October 2003 credited to Mcswiney, Michael ; Dubin, Valery ; Johnston, Steven ; Moon, Peter

Details

Application number :

2003284900  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Forming a copper diffusion barrier  

Inventor :

Mcswiney, Michael ; Dubin, Valery ; Johnston, Steven ; Moon, Peter  

Agent name :

 

Address for service :

 

Filing date :

23 October 2003  

Associated companies :

 

Applicant name :

INTEL CORPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

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