Pattern forming materials and pattern formation method using the materials
A Standard patent application filed on 20 October 2003 credited to Tominaga, Junji ; Kim, Joo-Ho

Details

Application number :

2003272105  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Pattern forming materials and pattern formation method using the materials  

Inventor :

Tominaga, Junji ; Kim, Joo-Ho  

Agent name :

 

Address for service :

 

Filing date :

20 October 2003  

Associated companies :

 

Applicant name :

SAMSUNG ELECTRONICS CO., LTD.  

Applicant address :

416, Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do 442-742  

Old name :

 

Original Source :

Go  

Same Inventor

• Recording method using reaction and diffusion, recording medium...
• Methods for manufacturing compound semiconductor and compound...
• Recording medium having high melting point recording layer,...
• High density recording medium with super-resolution near-field...