Hot melt adhesive composition based on a random copolymer of isotactic polypropylene
A Standard patent application filed on 11 September 2003 credited to Wang, Baoyu
;
Zhang, Chongyao
;
Kanderski, Monina Dapap
;
Svenningsen, Lacretia A.
;
Strelow, Diane M.
Details
Application number :
2003270467
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Hot melt adhesive composition based on a random copolymer of isotactic polypropylene
Inventor :
Wang, Baoyu
;
Zhang, Chongyao
;
Kanderski, Monina Dapap
;
Svenningsen, Lacretia A.
;
Strelow, Diane M.
Agent name :
Freehills Patent & Trade Mark Attorneys
Address for service :
Level 43 101 Collins Street Melbourne VIC 3000 Australia
Filing date :
11 September 2003
Associated companies :
Applicant name :
Bostik Findley, Inc
Applicant address :
11320 Watertown Plank Road Wauwatosa WI 53226-3413 United States of America