Hot melt adhesive composition based on a random copolymer of isotactic polypropylene and a secondary polymer
A Standard patent application filed on 27 October 2003 credited to Wang, Baoyu ; Zhang, Chongyao ; Kanderski, Monina Dadap ; Svenningsen, Lacretia A. ; Gibes, Mark A. ; Strelow, Diane M.

Details

Application number :

2003286679  

Application type :

Standard  

Application status :

SEALED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Hot melt adhesive composition based on a random copolymer of isotactic polypropylene and a secondary polymer  

Inventor :

Wang, Baoyu ; Zhang, Chongyao ; Kanderski, Monina Dadap ; Svenningsen, Lacretia A. ; Gibes, Mark A. ; Strelow, Diane M.  

Agent name :

Freehills Patent & Trade Mark Attorneys  

Address for service :

Level 43 101 Collins Street Melbourne VIC 3000 Australia  

Filing date :

27 October 2003  

Associated companies :

 

Applicant name :

Bostik Findley, Inc  

Applicant address :

11320 Watertown Plank Road Wauwatosa WI 53226-3413 United States of America  

Old name :

 

Original Source :

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