Details
- Application number :
- 2003266557
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Bonding device and method
- Inventor :
- Yamauchi, Akira
;
Ito, Toshihiro
;
Suga, Tadatomo
- Agent name :
-
- Address for service :
-
- Filing date :
- 22 September 2003
- Associated companies :
-
- Applicant name :
- SUGA, Tadatomo
- Applicant address :
- c/o Research Center for Advanced Science and Technology of The University of Tokyo, 6-1, Komaba 4-chome, Meguro-ku, Tokyo 153-8904
- Old name :
-
- Original Source :
- Go