Details
- Application number :
- 2003243906
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Bonding device and bonding method
- Inventor :
- Kaiser, Rudolf
;
Lapsien, Horst
- Agent name :
-
- Address for service :
-
- Filing date :
- 02 June 2003
- Associated companies :
-
- Applicant name :
- AMICRA MICROTECHNOLOGIES GMBH
- Applicant address :
- Donaustaufer Str. 115, 93059 Regensburg
- Old name :
-
- Original Source :
- Go