Method of attaching circuitry to a modular jack connector using electrically conductive paste
A Standard patent application filed on 13 May 2003 credited to Gandhi, Pradeep

Details

Application number :

2003247369  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of attaching circuitry to a modular jack connector using electrically conductive paste  

Inventor :

Gandhi, Pradeep  

Agent name :

 

Address for service :

 

Filing date :

13 May 2003  

Associated companies :

 

Applicant name :

ORMET CIRCUITS, INC.  

Applicant address :

2236 Rutherford Road, Suite 109, Carlsbad, CA 92008  

Old name :

 

Original Source :

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