Methods to produce robust multilayer circuitry for electronic packaging
A Standard patent application filed on 06 March 2000 credited to Gandhi, Pradeep ; Legerton, Gary E. ; Fu, Samuel ; Baxter, Daniel E.

Details

Application number :

38690  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Methods to produce robust multilayer circuitry for electronic packaging  

Inventor :

Gandhi, Pradeep ; Legerton, Gary E. ; Fu, Samuel ; Baxter, Daniel E.  

Agent name :

 

Address for service :

 

Filing date :

06 March 2000  

Associated companies :

 

Applicant name :

Ormet Corporation  

Applicant address :

 

Old name :

 

Original Source :

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