Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package

Application number :: 2003225950
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package
Inventor :: Fan, Chun Ho ; Mcclellan, Neil R. ; Combs, Edward G.
Agent name :
Address for service :
Filing date :: 21 March 2003
Associated companies :
Applicant name :: FAN, Chun Ho
Applicant address :: Flat E, 27/F, Block 3, Lido Garden, Sham Tseng, Hong Kong
Old name :
Original Source :: Go

Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package A Standard patent application filed on 21 March 2003 credited to Fan, Chun Ho ; Mcclellan, Neil R. ; Combs, Edward G.