Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package
A Standard patent application filed on 15 August 2002 credited to Fan, Chun Ho ; Combs, Edward G. ; Pun, Tai Wai ; Mclellan, Neil Robert ; Sheppard, Robert P. ; Ng, Hau Wan

Details

Application number :

2002324720  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package  

Inventor :

Fan, Chun Ho ; Combs, Edward G. ; Pun, Tai Wai ; Mclellan, Neil Robert ; Sheppard, Robert P. ; Ng, Hau Wan  

Agent name :

 

Address for service :

 

Filing date :

15 August 2002  

Associated companies :

 

Applicant name :

ASAT LIMITED  

Applicant address :

QPL Industrial Building, 138 Texaco Road, Tsuen Wan, NT, Hong Kong  

Old name :

 

Original Source :

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