Apparatus and method for depositing thin film on wafer using remote plasma
A Standard patent application filed on 17 April 2003 credited to Lim, Hong-Joo ; Kyung, Hyun-Soo ; Park, Young-Hoon ; Lee, Sang-Kyu ; Bae, Jang-Ho

Details

Application number :

2003223126  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Apparatus and method for depositing thin film on wafer using remote plasma  

Inventor :

Lim, Hong-Joo ; Kyung, Hyun-Soo ; Park, Young-Hoon ; Lee, Sang-Kyu ; Bae, Jang-Ho  

Agent name :

 

Address for service :

 

Filing date :

17 April 2003  

Associated companies :

 

Applicant name :

IPS LTD.  

Applicant address :

33 Jije-dong, Pyungtaek-city, Kyungki-do 450-090  

Old name :

 

Original Source :

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