Semiconductor device having a bond pad and method therefor
A Standard patent application filed on 12 March 2003 credited to Dinh, Dieu Van
;
Leal, George R.
;
Tran, Tu Anh
;
Yong, Lois E.
;
Harper, Peter R.
;
Metz, Jeffrey W.
Details
Application number :
2003218145
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Semiconductor device having a bond pad and method therefor
Inventor :
Dinh, Dieu Van
;
Leal, George R.
;
Tran, Tu Anh
;
Yong, Lois E.
;
Harper, Peter R.
;
Metz, Jeffrey W.
Agent name :
Address for service :
Filing date :
12 March 2003
Associated companies :
Applicant name :
FREESCALE SEMICONDUCTOR, INC.
Applicant address :
6501 William Cannon Drive West
Austin, TX 78735
United States of America