Semiconductor device having a wire bond pad and method therefor
A Standard patent application filed on 12 March 2003 credited to Hall, Geoffrey B. ; Downey, Susan H. ; Miller, James W.

Details

Application number :

2003218146  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor device having a wire bond pad and method therefor  

Inventor :

Hall, Geoffrey B. ; Downey, Susan H. ; Miller, James W.  

Agent name :

 

Address for service :

 

Filing date :

12 March 2003  

Associated companies :

 

Applicant name :

FREESCALE SEMICONDUCTOR, INC.  

Applicant address :

6501 William Cannon Drive West, Austin, TX 78735, USA  

Old name :

 

Original Source :

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