Hybrid disk-cone extrusion die module having a spillover surface surrounding a planar seal surface

Application number :: 2002355715
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Hybrid disk-cone extrusion die module having a spillover surface surrounding a planar seal surface
Inventor :: Blemberg, Robert John ; Davidson, Randolph L.
Agent name :
Address for service :
Filing date :: 20 June 2002
Associated companies :
Applicant name :: PECHINEY EMBALLAGE FLEXIBLE EUROPE
Applicant address :: 1 rue de l'Union, F-92843 Rueil Malmaison
Old name :
Original Source :: Go

Hybrid disk-cone extrusion die module having a spillover surface surrounding a planar seal surface A Standard patent application filed on 20 June 2002 credited to Blemberg, Robert John ; Davidson, Randolph L.