Hybrid disk-cone extrusion die module having a spillover surface surrounded by a planar seal surface
A Standard patent application filed on 20 June 2002 credited to Blemberg, Robert John ; Davidson, Randolph L.

Details

Application number :

2002318368  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Hybrid disk-cone extrusion die module having a spillover surface surrounded by a planar seal surface  

Inventor :

Blemberg, Robert John ; Davidson, Randolph L.  

Agent name :

 

Address for service :

 

Filing date :

20 June 2002  

Associated companies :

 

Applicant name :

PECHINEY EMBALLAGE FLEXIBLE EUROPE  

Applicant address :

1 rue de L'Union, F-92843 Rueil Malmaison  

Old name :

 

Original Source :

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