Details
- Application number :
- 2002307578
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- A method of wafer/substrate bonding
- Inventor :
- Xie, Hong
;
Wang, Zhiping
;
Wei, Jun
- Agent name :
-
- Address for service :
-
- Filing date :
- 30 April 2002
- Associated companies :
-
- Applicant name :
- AGENCY FOR SCIENCE TECHNOLOGY AND RESEARCH
- Applicant address :
- 20 Biopolis Way
#07-01 Centros
Singapore 138668
Singapore
- Old name :
-
- Original Source :
- Go