Details

Application number :
2002326985  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method of improving a surface of a substrate for wafer bonding  
Inventor :
Shi, Binqiang  
Agent name :
 
Address for service :
 
Filing date :
20 September 2002  
Associated companies :
 
Applicant name :
HRL LABORATORIES, LLC  
Applicant address :
3011 Malibu Canyon Road, Malibu, CA 90265-4799  
Old name :
 
Original Source :
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