Details
- Application number :
- 2002304147
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tape
- Inventor :
- Shimomura, Kazuhiro
;
Fukuoka, Masateru
;
Hatai, Munehiro
;
Oyama, Yasuhiko
;
Danjo, Shigeru
;
Hasegawa, Tsuyoshi
;
Hayashi, Satoshi
- Agent name :
-
- Address for service :
-
- Filing date :
- 03 June 2002
- Associated companies :
-
- Applicant name :
- SEKISUI CHEMICAL CO., LTD.
- Applicant address :
- 4-4, Nishitenma 2-chome, Kita-ku, Osaka-shi, Osaka 530-8565
- Old name :
-
- Original Source :
- Go