Pressure sensitive adhesive double coated tape and method for producing ic chip using it
A Standard patent application filed on 03 June 2002 credited to Shimomura, Kazuhiro ; Fukuoka, Masateru ; Hatai, Munehiro ; Oyama, Yasuhiko ; Danjo, Shigeru ; Hasegawa, Tsuyoshi ; Hayashi, Satoshi

Details

Application number :
2002304145  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Pressure sensitive adhesive double coated tape and method for producing ic chip using it  
Inventor :
Shimomura, Kazuhiro ; Fukuoka, Masateru ; Hatai, Munehiro ; Oyama, Yasuhiko ; Danjo, Shigeru ; Hasegawa, Tsuyoshi ; Hayashi, Satoshi  
Agent name :
 
Address for service :
 
Filing date :
03 June 2002  
Associated companies :
 
Applicant name :
SEKISUI CHEMICAL CO., LTD.  
Applicant address :
4-4, Nishitenma 2-chome, Kita-ku, Osaka-shi, Osaka 530-8565  
Old name :
 
Original Source :
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