Connection by deposition of a conductive material bead on a connecting zone delimited by an insulating mask
A Standard patent application filed on 28 March 2002 credited to Fidalgo, Jean-Christophe ; Cuenot, Yves-Pierre ; Patrice, Philippe ; Brunet, Olivier

Details

Application number :

2002255080  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Connection by deposition of a conductive material bead on a connecting zone delimited by an insulating mask  

Inventor :

Fidalgo, Jean-Christophe ; Cuenot, Yves-Pierre ; Patrice, Philippe ; Brunet, Olivier  

Agent name :

 

Address for service :

 

Filing date :

28 March 2002  

Associated companies :

 

Applicant name :

GEMPLUS  

Applicant address :

Avenue du Pic de Bertagne, Parc d'Activites de Gemenos, F-13420 Gemenos  

Old name :

 

Original Source :

Go  

Same Inventor

• Barrier against overflow for fixing adhesive of a semiconductor chip