Barrier against overflow for fixing adhesive of a semiconductor chip
A Standard patent application filed on 05 December 2001 credited to Fidalgo, Jean-Christophe ; Cuenot, Yves-Pierre ; Patrice, Philippe ; Brunet, Olivier

Details

Application number :

2002216172  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Barrier against overflow for fixing adhesive of a semiconductor chip  

Inventor :

Fidalgo, Jean-Christophe ; Cuenot, Yves-Pierre ; Patrice, Philippe ; Brunet, Olivier  

Agent name :

 

Address for service :

 

Filing date :

05 December 2001  

Associated companies :

 

Applicant name :

Gemplus  

Applicant address :

 

Old name :

 

Original Source :

Go  

Same Inventor

• Connection by deposition of a conductive material bead on a...