A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
A Standard patent application filed on 14 March 2002 credited to Kledzik, Kenneth

Details

Application number :

2002250437  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips  

Inventor :

Kledzik, Kenneth  

Agent name :

 

Address for service :

 

Filing date :

14 March 2002  

Associated companies :

 

Applicant name :

LEGACY ELECTRONICS, INC.  

Applicant address :

1001 Calle Amancer, San Clemente, CA 92673  

Old name :

 

Original Source :

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