Electronic module having a three dimensional array of carrier-mounted integratedcircuit packages
A Standard patent application filed on 13 March 2001 credited to Kledzik, Kenneth J.
;
Engle, Jason C.
Details
Application number :
2001249169
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Electronic module having a three dimensional array of carrier-mounted integratedcircuit packages