Windowed non-ceramic package having embedded frame
A Standard patent application filed on 23 November 1999 credited to Li, Zong-Fu ; Thompson, Deborah L. ; Sengupta, Kabul

Details

Application number :

17448  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Windowed non-ceramic package having embedded frame  

Inventor :

Li, Zong-Fu ; Thompson, Deborah L. ; Sengupta, Kabul  

Agent name :

 

Address for service :

 

Filing date :

23 November 1999  

Associated companies :

 

Applicant name :

Intel Corporation  

Applicant address :

 

Old name :

 

Original Source :

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