Leaf spring assembly having full leaf leaf spring component and half leaf leaf spring component
A Standard patent application filed on 23 February 2001 credited to Wilson, William
Details
Application number :
2001253821
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Leaf spring assembly having full leaf leaf spring component and half leaf leaf spring component
Inventor :
Wilson, William
Agent name :
Callinans
Address for service :
1193 Toorak Road Camberwell VIC 3124 Australia
Filing date :
23 February 2001
Associated companies :
Applicant name :
Hendrickson International Corporation
Applicant address :
500 Park Boulevard Suite 1010 Itasca Illinois 60143 United States of America