Method for improving bonding of rigid, thermosetting compositions to hydrophilicsurfaces, and the articles formed thereby
A Standard patent application filed on 11 April 2001 credited to Kim, Ki-Soo

Details

Application number :
2001251583  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for improving bonding of rigid, thermosetting compositions to hydrophilicsurfaces, and the articles formed thereby  
Inventor :
Kim, Ki-Soo  
Agent name :
 
Address for service :
 
Filing date :
11 April 2001  
Associated companies :
 
Applicant name :
World Properties Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor