Method and apparatus for manufacturing an interconnect structure
A Standard patent application filed on 06 April 2001 credited to Mistry, Addi B. ; Hagen, Deborah A. ; Carney, George F. ; Pozder, Scott K. ; Cole, Rebecca G. ; Chowdhury, Rina ; Ananthanarayanan, Kartik

Details

Application number :

2001251415  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for manufacturing an interconnect structure  

Inventor :

Mistry, Addi B. ; Hagen, Deborah A. ; Carney, George F. ; Pozder, Scott K. ; Cole, Rebecca G. ; Chowdhury, Rina ; Ananthanarayanan, Kartik  

Agent name :

 

Address for service :

 

Filing date :

06 April 2001  

Associated companies :

 

Applicant name :

Motorola, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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