Molded assembly with heating element captured therein
A Standard patent application filed on 06 April 2001 credited to Schlesselman, John W. ; Von Arx, Theodore ; Papenfuss, Ronald E. ; Laken, Keith

Details

Application number :

2001249915  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Molded assembly with heating element captured therein  

Inventor :

Schlesselman, John W. ; Von Arx, Theodore ; Papenfuss, Ronald E. ; Laken, Keith  

Agent name :

 

Address for service :

 

Filing date :

06 April 2001  

Associated companies :

 

Applicant name :

Watlow Polymer Technology  

Applicant address :

 

Old name :

 

Original Source :

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