Heat-transfer label including a phenoxy adhesive layer
A Standard patent application filed on 09 November 1999 credited to Laprade, Jean Paul ; Yang, Darchun Billy ; Geurtsen, Friedrich H.H. ; Nugent, James S.

Details

Application number :

17171  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Heat-transfer label including a phenoxy adhesive layer  

Inventor :

Laprade, Jean Paul ; Yang, Darchun Billy ; Geurtsen, Friedrich H.H. ; Nugent, James S.  

Agent name :

 

Address for service :

 

Filing date :

09 November 1999  

Associated companies :

 

Applicant name :

Avery Dennison Corporation  

Applicant address :

 

Old name :

 

Original Source :

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