Low resistance electrical and thermal bond and method of making same
A Standard patent application filed on 26 January 2001 credited to Smith, David Russell
;
Maclean, Gregory Kenneth
;
Massaro, Lisa Marie
;
Orabone Jr., William Edward
;
Kaczan, Stephanie Lynn
;
Huang, Sui-Yang
;
Lewandowski, Thongkhanh P.
;
Hopper, Michael A.
Details
Application number :
2001231185
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Low resistance electrical and thermal bond and method of making same
Inventor :
Smith, David Russell
;
Maclean, Gregory Kenneth
;
Massaro, Lisa Marie
;
Orabone Jr., William Edward
;
Kaczan, Stephanie Lynn
;
Huang, Sui-Yang
;
Lewandowski, Thongkhanh P.
;
Hopper, Michael A.