Details
- Application number :
- 52762
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Liquid curable resin composition and double layer
- Inventor :
- Ukachi, Takashi
;
Komiya, Zen
- Agent name :
-
- Address for service :
-
- Filing date :
- 03 April 2001
- Associated companies :
-
- Applicant name :
- DSM N.V.
- Applicant address :
-
- Old name :
-
- Original Source :
- Go